An enclosure for a portable computing device is disclosed. The enclosure includes an indicium (e.g., logo) positioned in an opening extending partially through the enclosure. The enclosure includes multiple material removal processes. First, a tool (e.g., laser ablation tool) can be used to ablate the opening defining an ablation having a shape or profile similar to that of the indicium. A second material removal process can remove a region within the ablation to define an indicium support. The second material removal process may be performed by a CNC cutting tool capable of forming the indicium support to a desired precision. As a result, when the indicium is secured with the indicium support, the indicium includes a desired flatness that prevents an undesired reflectivity. In order to ensure the indicium properly fits in the opening, a third material removal process may be performed to define an indention region around the opening.