公开(公告)号：US20160209870A1

公开(公告)日：2016-07-21

申请号：US14832976

申请日：2015-08-21

Applicant: Apple Inc.

Inventor： Houtan R. Farahani ,  Hsinhan Wu ,  Lindsay D. Corbet ,  Hilbert T. Kwan ,  Katherine Spriggs ,  You Fu Tan

IPC: G06F1/16 ,  G09F23/00 ,  G09F7/16

CPC classification number: G09F7/16 ,  G06F1/1616

Abstract: An enclosure for a portable computing device is disclosed. The enclosure includes an indicium (e.g., logo) positioned in an opening extending partially through the enclosure. The enclosure includes multiple material removal processes. First, a tool (e.g., laser ablation tool) can be used to ablate the opening defining an ablation having a shape or profile similar to that of the indicium. A second material removal process can remove a region within the ablation to define an indicium support. The second material removal process may be performed by a CNC cutting tool capable of forming the indicium support to a desired precision. As a result, when the indicium is secured with the indicium support, the indicium includes a desired flatness that prevents an undesired reflectivity. In order to ensure the indicium properly fits in the opening, a third material removal process may be performed to define an indention region around the opening.

Abstract translation: 公开了一种用于便携式计算设备的外壳。 外壳包括定位在部分穿过外壳的开口中的标记（例如徽标）。 外壳包括多个材料清除过程。 首先，可以使用工具（例如，激光烧蚀工具）来烧蚀限定具有与标记的形状或轮廓相似的形状或轮廓的切口。 第二材料去除过程可以去除消融内的区域以限定标记支撑。 第二材料去除过程可以由能够将标记支撑形成所需精度的CNC切割工具来执行。 结果，当标记用标记支撑件固定时，标记包括防止不期望的反射率的期望的平坦度。 为了确保标记适当地装配在开口中，可以执行第三材料去除过程以限定开口周围的缩进区域。

公开(公告)号：US09989992B2

公开(公告)日：2018-06-05

申请号：US14832976

申请日：2015-08-21

Applicant: Apple Inc.

Inventor： Houtan R. Farahani ,  Hsinhan Wu ,  Lindsay D. Corbet ,  Hilbert T. Kwan ,  Katherine Spriggs ,  You Fu Tan

IPC: G09F7/16 ,  G06F1/16

CPC classification number: G09F7/16 ,  G06F1/1616

Abstract: An enclosure for a portable computing device is disclosed. The enclosure includes an indicium (e.g., logo) positioned in an opening extending partially through the enclosure. The enclosure includes multiple material removal processes. First, a tool (e.g., laser ablation tool) can be used to ablate the opening defining an ablation having a shape or profile similar to that of the indicium. A second material removal process can remove a region within the ablation to define an indicium support. The second material removal process may be performed by a CNC cutting tool capable of forming the indicium support to a desired precision. As a result, when the indicium is secured with the indicium support, the indicium includes a desired flatness that prevents an undesired reflectivity. In order to ensure the indicium properly fits in the opening, a third material removal process may be performed to define an indention region around the opening.