A sensor may include a substrate defining a flow channel that extends through the substrate, and a plurality of bond pads on the substrate. A first housing may be disposed along the substrate and may permit at least some fluid to flow from a fluid inlet to a fluid outlet along at least part of the flow channel. A second housing may be disposed along the substrate. A sense die may be disposed between the second housing and the substrate and may include a sensing side facing the substrate with a sense element in registration with the flow channel and a plurality of bond pads on the sensing side that are in registration with, and bump bonded to, the plurality of bond pads on the substrate. An adhesive or other material may be disposed between the sensing side of the sense die and the substrate.