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公开(公告)号：US20160223379A1
公开(公告)日：2016-08-04
申请号：US14610957
申请日：2015-01-30
发明人： James Cook , Craig S. Becke , Jamie Speldrich
CPC分类号： G01F15/006 , G01F1/684 , G01F1/692
摘要： A sensor may include a substrate defining a flow channel that extends through the substrate, and a plurality of bond pads on the substrate. A first housing may be disposed along the substrate and may permit at least some fluid to flow from a fluid inlet to a fluid outlet along at least part of the flow channel. A second housing may be disposed along the substrate. A sense die may be disposed between the second housing and the substrate and may include a sensing side facing the substrate with a sense element in registration with the flow channel and a plurality of bond pads on the sensing side that are in registration with, and bump bonded to, the plurality of bond pads on the substrate. An adhesive or other material may be disposed between the sensing side of the sense die and the substrate.
摘要翻译： 传感器可以包括限定穿过衬底的流动通道的衬底，以及衬底上的多个接合焊盘。 第一壳体可以沿着衬底布置，并且可以允许至少一些流体沿着流动通道的至少一部分从流体入口流动到流体出口。 第二壳体可以沿着基板设置。 感测管芯可以设置在第二壳体和衬底之间，并且可以包括面向衬底的感测侧，其中感测元件与流动通道对准，并且感测侧上的多个接合焊盘与其对准，并且凸起 与基板上的多个接合焊盘接合。 粘合剂或其它材料可以设置在感测管芯的感测侧和衬底之间。
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公开(公告)号：US10107662B2
公开(公告)日：2018-10-23
申请号：US14610957
申请日：2015-01-30
发明人： James Cook , Craig S. Becke , Jamie Speldrich
摘要： A sensor may include a substrate defining a flow channel that extends through the substrate, and a plurality of bond pads on the substrate. A first housing may be disposed along the substrate and may permit at least some fluid to flow from a fluid inlet to a fluid outlet along at least part of the flow channel. A second housing may be disposed along the substrate. A sense die may be disposed between the second housing and the substrate and may include a sensing side facing the substrate with a sense element in registration with the flow channel and a plurality of bond pads on the sensing side that are in registration with, and bump bonded to, the plurality of bond pads on the substrate. An adhesive or other material may be disposed between the sensing side of the sense die and the substrate.
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