Invention Application
- Patent Title: APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE
- Patent Title (中): 用于处理基板的装置和方法
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Application No.: US15015061Application Date: 2016-02-03
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Publication No.: US20160233129A1Publication Date: 2016-08-11
- Inventor: Bing-Joe Hwang , Wei-Nien Su , Jeng-Ywan Jeng , Yuan-Han Chu , Tse-Ming Chiu , Hsin-Fu Teng
- Applicant: National Taiwan University of Science and Technology
- Applicant Address: TW Taipei
- Assignee: National Taiwan University of Science and Technology
- Current Assignee: National Taiwan University of Science and Technology
- Current Assignee Address: TW Taipei
- Priority: TW104104167 20150206
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/306 ; H01L21/3063
Abstract:
A method of processing a substrate is disclosed. The method includes the following steps: providing a substrate body having a surface; placing a die on the surface, wherein the die acts as a catalyst; immersing the substrate body and the die in a reaction solution; and processing the substrate body via a chemical reaction occurring on the surface through the reaction solution and the catalyst.
Public/Granted literature
- US09852948B2 Apparatus and method for processing a substrate Public/Granted day:2017-12-26
Information query
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