公开(公告)号：US10211105B2

公开(公告)日：2019-02-19

申请号：US15816247

申请日：2017-11-17

申请人： National Taiwan University of Science and Technology

发明人： Bing-Joe Hwang ,  Wei-Nien Su ,  Jeng-Ywan Jeng ,  Yuan-Han Chu ,  Tse-Ming Chiu ,  Hsin-Fu Teng

IPC分类号： H01L21/306 ,  H01L21/78 ,  B28D5/04 ,  H01L21/3063

摘要： An apparatus for cutting a substrate is disclosed. The apparatus includes a main body containing a reactive solution and the substrate; and a catalytic cutting element disposed inside the main body and contacting one of at least two adjacent cutting peripheries of the substrate to conduct a chemical reaction to cut the substrate.

公开(公告)号：US09852948B2

公开(公告)日：2017-12-26

申请号：US15015061

申请日：2016-02-03

申请人： National Taiwan University of Science and Technology

发明人： Bing-Joe Hwang ,  Wei-Nien Su ,  Jeng-Ywan Jeng ,  Yuan-Han Chu ,  Tse-Ming Chiu ,  Hsin-Fu Teng

IPC分类号： H01L21/306 ,  H01L21/78 ,  B28D5/04 ,  H01L21/3063

CPC分类号： H01L21/78 ,  B28D5/04 ,  H01L21/30604 ,  H01L21/3063

摘要： A method of processing a substrate is disclosed. The method includes the following steps: providing a substrate body having a surface; placing a die on the surface, wherein the die acts as a catalyst; immersing the substrate body and the die in a reaction solution; and processing the substrate body via a chemical reaction occurring on the surface through the reaction solution and the catalyst.

公开(公告)号：US20180076089A1

公开(公告)日：2018-03-15

申请号：US15816247

申请日：2017-11-17

申请人： National Taiwan University of Science and Technology

发明人： Bing-Joe Hwang ,  Wei-Nien Su ,  Jeng-Ywan Jeng ,  Yuan-Han Chu ,  Tse-Ming Chiu ,  Hsin-Fu Teng

IPC分类号： H01L21/78 ,  B28D5/04 ,  H01L21/306 ,  H01L21/3063

CPC分类号： H01L21/78 ,  B28D5/04 ,  H01L21/306 ,  H01L21/30604 ,  H01L21/3063

摘要： An apparatus for cutting a substrate is disclosed. The apparatus includes a main body containing a reactive solution and the substrate; and a catalytic cutting element disposed inside the main body and contacting one of at least two adjacent cutting peripheries of the substrate to conduct a chemical reaction to cut the substrate.

公开(公告)号：US20160233129A1

公开(公告)日：2016-08-11

申请号：US15015061

申请日：2016-02-03

申请人： National Taiwan University of Science and Technology

发明人： Bing-Joe Hwang ,  Wei-Nien Su ,  Jeng-Ywan Jeng ,  Yuan-Han Chu ,  Tse-Ming Chiu ,  Hsin-Fu Teng

IPC分类号： H01L21/78 ,  H01L21/306 ,  H01L21/3063

CPC分类号： H01L21/78 ,  B28D5/04 ,  H01L21/30604 ,  H01L21/3063

摘要： A method of processing a substrate is disclosed. The method includes the following steps: providing a substrate body having a surface; placing a die on the surface, wherein the die acts as a catalyst; immersing the substrate body and the die in a reaction solution; and processing the substrate body via a chemical reaction occurring on the surface through the reaction solution and the catalyst.

摘要翻译： 公开了一种处理衬底的方法。 该方法包括以下步骤：提供具有表面的基底主体; 将模具放置在表面上，其中模具用作催化剂; 将基体和模头浸入反应溶液中; 以及通过反应溶液和催化剂在表面上发生的化学反应来处理衬底体。