发明申请
- 专利标题： SYSTEMS AND PROCESSES FOR FORMING THREE-DIMENSIONAL INTEGRATED CIRCUITS
- 专利标题（中）： 形成三维集成电路的系统和过程
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申请号： US15141783申请日： 2016-04-28
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公开(公告)号： US20160240440A1公开(公告)日： 2016-08-18
- 发明人: Arthur W. Zafiropoulo , Yun Wang , Andrew M. Hawryluk
- 申请人： Ultratech, Inc.
- 申请人地址： US CA San Jose
- 专利权人： Ultratech, Inc.
- 当前专利权人： Ultratech, Inc.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L21/822
- IPC分类号： H01L21/822 ; H01L27/06 ; H01L21/02
摘要：
Provided are systems and processes for forming a three-dimensional circuit on a substrate. A radiation source produces a beam that is directed at a substrate having an isolating layer interposed between circuit layers. The circuit layers communicate with each other via a seed region exhibiting a crystalline surface. At least one circuit layer has an initial microstructure that exhibits electronic properties unsuitable for forming circuit features therein. After being controllably heat treated, the initial microstructure of the circuit layer having unsuitable properties is transformed into one that exhibits electronic properties suitable for forming circuit feature therein. Also provided are three-dimensional circuit structures optionally formed by the inventive systems and/or processes.