发明申请
- 专利标题: ELECTROMAGNETIC SHIELD STRUCTURE FOR ELECTRONIC DEVICE
- 专利标题(中): 电子设备电磁屏蔽结构
-
申请号: US15045841申请日: 2016-02-17
-
公开(公告)号: US20160242331A1公开(公告)日: 2016-08-18
- 发明人: Jung-Sik PARK , Seung-Ki CHOI , Joon HEO , Hyun-Ju HONG
- 申请人: Samsung Electronics Co., Ltd.
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 优先权: KR10-2015-0024499 20150217
- 主分类号: H05K9/00
- IPC分类号: H05K9/00 ; H05K5/00
摘要:
An electronic device is provided that includes a PCB including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.
公开/授权文献
- US09943018B2 Electromagnetic shield structure for electronic device 公开/授权日:2018-04-10