公开(公告)号：US20160147263A1

公开(公告)日：2016-05-26

申请号：US14948640

申请日：2015-11-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung-Ki CHOI ,  Seung-Hoon LEE

IPC: G06F1/16

CPC classification number: G06F1/1652 ,  G06F1/1616 ,  G06F1/1626

Abstract: An electronic device may include a foldable housing, and at least one electronic component arranged within the housing. The at least one electronic component may be exposed to an area external to the housing through a folding part of the housing in a folded state of the housing. The electronic device may be transitionable between a folded state and an unfolded state. Activation of the at least one electronic component may be effected by the folding or unfolding of the electronic device.

Abstract translation: 电子设备可以包括可折叠壳体，以及布置在壳体内的至少一个电子部件。 所述至少一个电子部件可以在壳体的折叠状态下通过壳体的折叠部分暴露于壳体外部的区域。 电子设备可以在折叠状态和展开状态之间转换。 可以通过电子设备的折叠或展开来实现至少一个电子部件的激活。

公开(公告)号：US20180228061A1

公开(公告)日：2018-08-09

申请号：US15943338

申请日：2018-04-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Sik PARK ,  Seung-Ki CHOI ,  Joon HEO ,  Hyun-Ju HONG

IPC: H05K9/00 ,  H05K5/00 ,  H05K1/02

CPC classification number: H05K9/002 ,  H01L2224/16225 ,  H05K1/0218 ,  H05K1/0259 ,  H05K5/0004 ,  H05K5/0017 ,  H05K9/0024 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/09354 ,  H05K2201/10371

Abstract: An electronic device is provided that includes a PCB including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.

公开(公告)号：US20150194758A1

公开(公告)日：2015-07-09

申请号：US14591385

申请日：2015-01-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun HUR ,  Seung-Ki CHOI

IPC: H01R13/22

CPC classification number: H01R13/22 ,  H01R12/73 ,  H01R13/2428 ,  H01R13/2442 ,  H01R2201/02 ,  H01R2201/16 ,  H04M1/0262 ,  H04M1/0274

Abstract: A connector is provided. The connector includes a terminal body, at least one first connection terminal disposed at a first surface of the terminal body, and at least one second connection terminal disposed at a second surface of the terminal body. The at least one first connection terminal and the at least one second connection terminal are electrically connected, and the at least one first connection terminal moves independently of the at least one second connection terminal.

Abstract translation: 提供一个连接器。 连接器包括端子主体，设置在端子主体的第一表面处的至少一个第一连接端子和设置在端子主体的第二表面处的至少一个第二连接端子。 所述至少一个第一连接端子和所述至少一个第二连接端子电连接，并且所述至少一个第一连接端子独立于所述至少一个第二连接端子移动。

公开(公告)号：US20180267390A1

公开(公告)日：2018-09-20

申请号：US15921967

申请日：2018-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongeun KIM ,  Jung-Sik PARK ,  Seung-Ki CHOI ,  Soo-Jung KIM

IPC: G03B17/55 ,  H04N5/225 ,  H04M1/02

CPC classification number: G03B17/55 ,  H04M1/0264 ,  H04N5/2252 ,  H04N5/22521 ,  H04N5/2256 ,  H04N5/2257

Abstract: An electronic device according to various embodiments of the present disclosure can include at least one heat component, a camera module comprising a camera disposed near the at least one heat component, and a support comprising a first opening in which the camera module is inserted and disposed with a gap along at least a portion of a periphery of the camera module.

公开(公告)号：US20160242331A1

公开(公告)日：2016-08-18

申请号：US15045841

申请日：2016-02-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Sik PARK ,  Seung-Ki CHOI ,  Joon HEO ,  Hyun-Ju HONG

IPC: H05K9/00 ,  H05K5/00

CPC classification number: H05K9/002 ,  H01L2224/16225 ,  H05K1/0218 ,  H05K1/0259 ,  H05K5/0004 ,  H05K5/0017 ,  H05K9/0024 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/09354 ,  H05K2201/10371

Abstract: An electronic device is provided that includes a PCB including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.

Abstract translation: 提供一种电子设备，其包括：PCB，其包括第一表面，第二表面和侧表面; 布置在所述第一表面上的与所述侧表面的一部分相邻的电子部件; 屏蔽结构，其包括覆盖电子部件的盖和从盖的周边延伸到PCB的第一表面的侧壁，其中侧壁沿不平行于PCB的第一表面的第一方向延伸; 第一导电结构，其形成在所述PCB的侧表面的一部分上; 以及形成在所述第一表面的要连接到所述第一导电结构的部分上的第二导电结构。 当从PCB的第一表面上方观察时，侧壁与PCB的第一表面接触并与第二导电结构重叠。

公开(公告)号：US20160190736A1

公开(公告)日：2016-06-30

申请号：US14959300

申请日：2015-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woo-Sung CHUN ,  Seung-Ki CHOI ,  Ju-Nyun KIM

IPC: H01R13/62 ,  H01R12/77

CPC classification number: H01R13/6205 ,  H01R13/64 ,  H01R2107/00

Abstract: A connector may include a plurality of contacts electrically connected to a mating connector and separated from one another. At least one of the contacts may include a magnet, and a conductive housing for surrounding at least one side of the magnet.

Abstract translation: 连接器可以包括电连接到配合连接器并且彼此分离的多个触点。 触点中的至少一个可以包括磁体和用于围绕磁体的至少一侧的导电壳体。

公开(公告)号：US20150192438A1

公开(公告)日：2015-07-09

申请号：US14591289

申请日：2015-01-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung-Ki CHOI ,  Seung-Hoon LEE ,  Joon HEO ,  Jong-Jin KIM

IPC: G01D11/26 ,  G01D11/24

CPC classification number: G01D11/26 ,  G06F1/1626 ,  G06F1/1684 ,  G06F1/1686 ,  H04N21/42201 ,  H04N21/42202

Abstract: A device including an optical sensor is provided. The device includes a window including a first region, a second region and a partial region located between the first region and the second region, an optical sensor located inside one region among the first region and the second region, and a light blocking part formed in the partial region of the window.

Abstract translation: 提供了包括光学传感器的装置。 该装置包括：第一区域，第二区域和位于第一区域和第二区域之间的部分区域的窗口，位于第一区域和第二区域内的一个区域内的光学传感器，以及形成在 窗口的部分区域。

公开(公告)号：US20150190094A1

公开(公告)日：2015-07-09

申请号：US14590584

申请日：2015-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung-Hoon LEE ,  Min-Woo PARK ,  Seung-Ki CHOI

IPC: A61B5/00 ,  A61B5/1455 ,  A61B5/024

CPC classification number: A61B5/6898 ,  A61B5/0022 ,  A61B5/02427 ,  A61B5/117 ,  A61B5/14551 ,  A61B5/742 ,  A61B2560/0462 ,  A61B2562/185 ,  G06F21/32 ,  H04L63/0861 ,  H04W4/80 ,  H04W12/06

Abstract: A mobile electronic device is provided. The mobile electronic device includes at least one processor, a display module electrically connected with the at least one processor, a communication module electrically connected with the at least one processor, a portable electronic device housing configured to house at least a part of the display module, the at least one processor, and the communication module, and a Heart Rate (HR) sensor (e.g., a Heart Rate Monitor (HRM) sensor) which is placed on one surface of the housing and has at least its part exposed to an outside, and which is electrically connected with the at least one processor.

Abstract translation: 提供移动电子设备。 所述移动电子设备包括至少一个处理器，与所述至少一个处理器电连接的显示模块，与所述至少一个处理器电连接的通信模块，配置成容纳所述显示模块的至少一部分的便携式电子设备外壳 ，所述至少一个处理器和通信模块以及心率（HR）传感器（例如，心率监测器（HRM）传感器）），其被放置在所述壳体的一个表面上并且至少其部分暴露于 外部并且与至少一个处理器电连接。

公开(公告)号：US20140307356A1

公开(公告)日：2014-10-16

申请号：US14251986

申请日：2014-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-Ju HONG ,  Seung-Ki CHOI

IPC: H02H5/08

CPC classification number: H02H5/083

Abstract: Provided is an operating method of an electronic device including a first processor, a humidity sensor, a second processor controlling the humidity sensor, and a battery, wherein the second processor and the battery are waterproofed. The method may include: detecting a power supply event from the battery; supplying a power from the battery to the second processor controlling the humidity sensor and not supplying the power to the first processor; determining, by the second processor, a humidity of the electronic device by using the humidity sensor; and when the humidity of the electronic device is greater than a first reference humidity, cutting off power supply from the battery and when the humidity of the electronic device is less than the first reference humidity, supplying the power to the first processor.

Abstract translation: 本发明提供一种包括第一处理器，湿度传感器，控制湿度传感器的第二处理器和电池的电子设备的操作方法，其中第二处理器和电池是防水的。 该方法可以包括：检测来自电池的电源事件; 从所述电池向所述第二处理器提供电力，所述第二处理器控制所述湿度传感器并且不向所述第一处理器供电; 由所述第二处理器通过使用所述湿度传感器确定所述电子设备的湿度; 并且当所述电子设备的湿度大于第一基准湿度时，切断来自所述电池的电力供应，以及当所述电子设备的湿度小于所述第一基准湿度时，向所述第一处理器供电。