发明申请
US20160260764A1 Pad Structure Exposed in an Opening Through Multiple Dielectric Layers in BSI Image Sensor Chips
审中-公开
在BSI图像传感器芯片中通过多个介质层的开口暴露的焊盘结构
- 专利标题: Pad Structure Exposed in an Opening Through Multiple Dielectric Layers in BSI Image Sensor Chips
- 专利标题(中): 在BSI图像传感器芯片中通过多个介质层的开口暴露的焊盘结构
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申请号: US15155961申请日: 2016-05-16
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公开(公告)号: US20160260764A1公开(公告)日: 2016-09-08
- 发明人: Jeng-Shyan Lin , Dun-Nian Yaung , Jen-Cheng Liu , Wen-De Wang , Shuang-Ji Tsai , Yueh-Chiou Lin
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 主分类号: H01L27/146
- IPC分类号: H01L27/146
摘要:
An integrated circuit structure includes a semiconductor substrate, and a dielectric pad extending from a bottom surface of the semiconductor substrate up into the semiconductor substrate. A low-k dielectric layer is disposed underlying the semiconductor substrate. A first non-low-k dielectric layer is underlying the low-k dielectric layer. A metal pad is underlying the first non-low-k dielectric layer. A second non-low-k dielectric layer is underlying the metal pad. An opening extends from a top surface of the semiconductor substrate down to penetrate through the semiconductor substrate, the dielectric pad, and the low-k dielectric layer, wherein the opening lands on a top surface of the metal pad. A passivation layer includes a portion on a sidewall of the opening, wherein a portion of the passivation layer at a bottom of the opening is removed.