Invention Application
- Patent Title: Polishing System with Front Side Pressure Control
- Patent Title (中): 具有前侧压力控制的抛光系统
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Application No.: US15173491Application Date: 2016-06-03
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Publication No.: US20160279756A1Publication Date: 2016-09-29
- Inventor: Shou-Sung Chang , Takashi Fujikawa , Hung Chih Chen , Paul D. Butterfield
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: B24B37/005
- IPC: B24B37/005 ; B24B37/10
Abstract:
A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.
Public/Granted literature
- US09808906B2 Polishing system with front side pressure control Public/Granted day:2017-11-07
Information query
