A method for removing plate-like elements, such as panels, paneling elements, plates, laminas, covering layers, and the like, coupled stably to a respective base by way of the interposition of an adhesive, which consists in: exposing, in a step a., the plate-like element to be removed to a source of infrared radiation to increase the temperature of the plate-like element and consequently of the adhesive by the heat conveyed by the infrared radiation; extending, in a step b., the exposure of the plate-like element to the source until the mechanical properties of the adhesive are lost; removing, in a step c., the plate-like element from the base.