A block has a planar portion abutting a back side of a contact region of a flexible substrate, and a recess that is concave with respect to the planar portion. An electronic component mounted on the flexible substrate is located within the recess. When viewed from a direction perpendicular to the planar portion, the recess is located at a position near a power supply bump, except at a position overlapping the power supply bump, or the recess is filled with a filler. The planar portion of the block abuts only the back side of the power supply bump.