Invention Application
US20160293286A1 CONDUCTIVE COMPLEX AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE CONDUCTIVE COMPLEX
审中-公开
导电复合物及其制造方法以及包括导电复合物的电子器件
- Patent Title: CONDUCTIVE COMPLEX AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE CONDUCTIVE COMPLEX
- Patent Title (中): 导电复合物及其制造方法以及包括导电复合物的电子器件
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Application No.: US14868651Application Date: 2015-09-29
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Publication No.: US20160293286A1Publication Date: 2016-10-06
- Inventor: Hiesang SOHN , Weonho SHIN , Se Yun KIM , Sungwoo HWANG , Hee Jung PARK , Jongmin LEE
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Priority: KR10-2015-0046220 20150401
- Main IPC: H01B1/02
- IPC: H01B1/02 ; C09D11/52 ; H01B13/00 ; H01B3/10
Abstract:
A conductive complex includes a conductive nanobody network including a plurality of conductive nanobodies randomly arranged, and an overcoat layer including zero-dimensionally, one-dimensionally or two-dimensionally shaped non-conductive nanobodies covering the conductive nanobody network. A method of manufacturing the same and an electronic device including the conductive complex are also disclosed.
Information query
