发明申请
- 专利标题: Memory First Process Flow and Device
- 专利标题(中): 内存第一流程和设备
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申请号: US15181138申请日: 2016-06-13
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公开(公告)号: US20160293720A1公开(公告)日: 2016-10-06
- 发明人: Shenqing Fang , Chun Chen , Unsoon Kim , Mark Ramsbey , Kuo Tung CHANG , Sameer HADDAD , James Pak
- 申请人: Cypress Semiconductor Corporation
- 主分类号: H01L29/423
- IPC分类号: H01L29/423 ; H01L29/66 ; H01L29/792
摘要:
A semiconductor device includes a substrate comprising a source region and a drain region, a bit storing element formed on the substrate, a memory gate structure, a first insulating layer formed on the substrate, a second insulating layer formed on the substrate, and a select gate structure formed on the first insulating layer. The second insulating layer is formed on the memory gate structure and the select gate structure and between the memory gate structure and the select gate structure.
公开/授权文献
- US09917166B2 Memory first process flow and device 公开/授权日:2018-03-13
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