Invention Application
US20160293897A1 OLED DEVICE PACKAGE AND PACKAGING METHOD THEREOF, AND LIGHT-EMITTING DEVICE
审中-公开
OLED器件封装及其封装方法和发光器件
- Patent Title: OLED DEVICE PACKAGE AND PACKAGING METHOD THEREOF, AND LIGHT-EMITTING DEVICE
- Patent Title (中): OLED器件封装及其封装方法和发光器件
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Application No.: US14436714Application Date: 2014-09-02
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Publication No.: US20160293897A1Publication Date: 2016-10-06
- Inventor: Wei QUAN , Chun Jan WANG
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Priority: CN201410086385.8 20140310
- International Application: PCT/CN2014/085763 WO 20140902
- Main IPC: H01L51/56
- IPC: H01L51/56 ; H01L51/52
Abstract:
An OLED device package (01), a packaging method thereof and a lighting-emitting device are provided. The OLED device package (01) comprises: a device substrate (10), a package substrate (20) bonded with the device substrate (10), and an adhesive film (30) disposed between the device substrate (10) and the package substrate (20). The device substrate comprises a base substrate (101) and an OLED device disposed on the base substrate (101). The package (01) further comprises: a buffer layer (40) disposed between the device substrate (10) and the adhesive film (30); A side of the buffer layer in contact with the adhesive film is an uneven surface.
Information query
IPC分类:
