A chip slapper is presented, having a substrate, a conductive layer disposed above the substrate face, and an intermediate layer disposed between the substrate face and the conductive layer. The conductive layer and intermediate layer form a first land and a second land atop the substrate face, with a bridge formed of the intermediate layer spanning between the first land and the second land. A first adhesion portion is attached to the first land, and a second adhesion portion is attached to the second land, wherein at least a portion of the bridge is not overlaid by the first adhesion portion or the second adhesion portion.