发明申请
US20160306272A1 EXTREME ULTRAVIOLET LITHOGRAPHY PROCESS AND MASK 有权
极致超紫外线光刻工艺和掩模

EXTREME ULTRAVIOLET LITHOGRAPHY PROCESS AND MASK
摘要:
An extreme ultraviolet lithography (EUVL) system is disclosed. The system includes an extreme ultraviolet (EUV) mask with three states having respective reflection coefficient is r1, r2 and r3, wherein r3 is a pre-specified value that is a function of r1 and r2. The system also includes a nearly on-axis illumination (ONI) with partial coherence a less than 0.3 to expose the EUV mask to produce diffracted light and non-diffracted light. The system further includes a projection optics box (PUB) to remove a portion of the non-diffracted light and to collect and direct the diffracted light and the remaining non-diffracted light to expose a target.
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