发明申请
- 专利标题: EXTREME ULTRAVIOLET LITHOGRAPHY PROCESS AND MASK
- 专利标题(中): 极致超紫外线光刻工艺和掩模
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申请号: US15194072申请日: 2016-06-27
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公开(公告)号: US20160306272A1公开(公告)日: 2016-10-20
- 发明人: Yen-Cheng Lu , Jeng-Horng Chen , Shinn-Sheng Yu , Anthony Yen
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 主分类号: G03F1/24
- IPC分类号: G03F1/24 ; G03F7/20
摘要:
An extreme ultraviolet lithography (EUVL) system is disclosed. The system includes an extreme ultraviolet (EUV) mask with three states having respective reflection coefficient is r1, r2 and r3, wherein r3 is a pre-specified value that is a function of r1 and r2. The system also includes a nearly on-axis illumination (ONI) with partial coherence a less than 0.3 to expose the EUV mask to produce diffracted light and non-diffracted light. The system further includes a projection optics box (PUB) to remove a portion of the non-diffracted light and to collect and direct the diffracted light and the remaining non-diffracted light to expose a target.
公开/授权文献
- US09996013B2 Extreme ultraviolet lithography process and mask 公开/授权日:2018-06-12
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