Invention Application
- Patent Title: STACKED GRID FOR MORE UNIFORM OPTICAL INPUT
- Patent Title (中): 堆叠网格更均匀的光学输入
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Application No.: US14688106Application Date: 2015-04-16
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Publication No.: US20160307941A1Publication Date: 2016-10-20
- Inventor: Yun-Wei Cheng , Horng-Huei Tseng , Chao-Hsiung Wang , Chun-Hao Chou , Tsung-Han Tsai , Kuo-Cheng Lee , Yung-Lung Hsu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
A back side illumination (BSI) image sensor with stacked grid shifting is provided. A pixel sensor is arranged within a semiconductor substrate. A metallic grid segment is arranged over the pixel sensor and has a metallic grid opening therein. A center of the metallic grid opening is laterally shifted from a center of the pixel sensor. A dielectric grid segment is arranged over the metallic grid and has a dielectric grid opening therein. A center of the dielectric grid opening is laterally shifted from the center of the pixel sensor. A method for manufacturing the BSI image sensor is also provided.
Public/Granted literature
- US09853076B2 Stacked grid for more uniform optical input Public/Granted day:2017-12-26
Information query
IPC分类:
