Invention Application
- Patent Title: METHOD OF PRODUCING BUMPS IN ELECTRONIC COMPONENTS, CORRESPONDING COMPONENT AND COMPUTER PROGRAM PRODUCT
- Patent Title (中): 电子元件生产方法，相关元件与计算机程序产品
-
Application No.: US14980616Application Date: 2015-12-28
-
Publication No.: US20160315059A1Publication Date: 2016-10-27
- Inventor: Paolo CREMA , Pierangelo MAGNI
- Applicant: STMICROELECTRONICS S.R.L.
- Priority: ITTO2015A000229 20150424
- Main IPC: H01L23/00
- IPC: H01L23/00 ; B29C67/00 ; G05B19/418
Abstract:
An electronic component, such as an integrated circuit, includes one or more circuits with bumps extending in a longitudinal direction outward from the circuit. The bumps may be formed, e.g., by 3D printing, with at least one protrusion extending away from the longitudinal direction.
Information query
IPC分类:
