Invention Application
US20160322333A1 Electronic module comprising fluid cooling channel and method of manufacturing the same
审中-公开
包括流体冷却通道的电子模块及其制造方法
- Patent Title: Electronic module comprising fluid cooling channel and method of manufacturing the same
- Patent Title (中): 包括流体冷却通道的电子模块及其制造方法
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Application No.: US15137062Application Date: 2016-04-25
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Publication No.: US20160322333A1Publication Date: 2016-11-03
- Inventor: Edward FUERGUT , Martin GRUBER , Wolfram HABLE
- Applicant: Infineon Technologies AG
- Priority: DE102015106552.5 20150428
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/367 ; H01L23/473 ; H01L25/00 ; H01L23/00 ; H01L25/07 ; H01L21/56 ; H01L23/31 ; H01L23/498
Abstract:
Various embodiments provide an electronic module comprising a interposer comprising a fluid channel formed in an electrically isolating material and an electrically conductive structured layer; at least one electronic chip attached to the electrically conductive layer and in thermal contact to the fluid channel; and a molded encapsulation formed at least partially around the at least one electronic chip, wherein the electrically conductive structured layer is directly formed on the electrically isolating material.
Public/Granted literature
- US10037972B2 Electronic module comprising fluid cooling channel and method of manufacturing the same Public/Granted day:2018-07-31
Information query
IPC分类:
