发明申请
- 专利标题: Super-Junction Semiconductor Device Comprising Junction Termination Extension Structure and Method of Manufacturing
- 专利标题(中): 包含接线端接延伸结构和制造方法的超级结半导体器件
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申请号: US15139664申请日: 2016-04-27
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公开(公告)号: US20160322490A1公开(公告)日: 2016-11-03
- 发明人: Franz Hirler , Daniel Tutuc , Andreas Voerckel , Hans Weber
- 申请人: Infineon Technologies Austria AG
- 优先权: DE102015106693.9 20150429
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/417 ; H01L29/167 ; H01L21/266 ; H01L29/66 ; H01L29/06 ; H01L29/36
摘要:
A super-junction semiconductor device includes a junction termination area at a first surface of a semiconductor body and at least partly surrounding an active cell area. An inner part of the junction termination area is arranged between an outer part of the junction termination area and the active cell area. A charge compensation device structure includes first regions of a first conductivity type and second regions of a second conductivity type disposed alternately along a first lateral direction. First surface areas correspond to a projection of the first regions onto the first surface, and second surface areas correspond to a projection of the second regions onto the first surface. The super-junction semiconductor device further includes at least one of a first junction termination extension structure and a second junction termination extension structure.
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