Invention Application
- Patent Title: THERMAL SPRAY MATERIAL
- Patent Title (中): 热喷涂材料
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Application No.: US15110141Application Date: 2014-11-07
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Publication No.: US20160326057A1Publication Date: 2016-11-10
- Inventor: Kazuhiro HONDA , Taijirou MATSUI
- Applicant: KROSAKIHARIMA CORPORATION
- Applicant Address: JP Fukuoka
- Assignee: KROSAKIHARIMA CORPORATION
- Current Assignee: KROSAKIHARIMA CORPORATION
- Current Assignee Address: JP Fukuoka
- Priority: JP2014-014601 20140129
- International Application: PCT/JP2014/079584 WO 20141107
- Main IPC: C04B35/14
- IPC: C04B35/14 ; C23C4/067 ; C04B35/622

Abstract:
Disclosed is a technique for suppressing a firing property and a dust generating property while improving bondability, in a thermal spray material for use in a thermite spraying process. The thermal spray material comprises a refractory material powder and a metal Si powder and capable of being sprayed onto a target surface using oxygen or oxygen-containing gas as a carrier gas and melt-adhered to the target surface based on heat generated by combustion of the metal Si powder, wherein the metal Si powder is contained in an amount of 10 to 25 mass % with respect to the entire thermal spray material, and wherein the metal Si powder has a median size of 10 μm or less, and contains a fraction having a particle size of 2 μm or less in an amount of 8 mass % or less with respect to the entire metal Si powder.
Public/Granted literature
- US09718734B2 Thermal spray material Public/Granted day:2017-08-01
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