Invention Application
- Patent Title: TUNABLE TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY
- Patent Title (中): 可控温度控制基板支持总成
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Application No.: US15212946Application Date: 2016-07-18
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Publication No.: US20160329231A1Publication Date: 2016-11-10
- Inventor: Vijay D. PARKHE , Steven E. BABAYAN , Konstantin MAKHRATCHEV , Zhiqiang GUO , Phillip R. SOMMER , Dan A. MAROHL
- Applicant: Applied Materials, Inc.
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H05B1/02 ; H01L21/67

Abstract:
Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.
Public/Granted literature
- US10535544B2 Tunable temperature controlled substrate support assembly Public/Granted day:2020-01-14
Information query
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