发明申请
- 专利标题： Method of Separating a Carrier-Workpiece Bonded Stack
- 专利标题（中）： 分离载体 - 工件粘合堆叠的方法
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申请号： US14797124申请日： 2015-07-11
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公开(公告)号： US20160332436A1公开(公告)日： 2016-11-17
- 发明人: Hao Tang , Yushen Zeng
- 申请人： Hao Tang , Yushen Zeng
- 申请人地址： US CA San Diego
- 专利权人： MICRO MATERIALS INC.
- 当前专利权人： MICRO MATERIALS INC.
- 当前专利权人地址： US CA San Diego
- 优先权： CN201510247398.3 20150514
- 主分类号： B32B43/00
- IPC分类号： B32B43/00 ; B32B37/06 ; B32B38/10
摘要：
The present invention provides a method of separating a bonded stack utilizing the force generated by a gas jet. The stack includes a carrier and a thinned workpiece such as device wafer that are bonded together through one or more layers therebetween. The gas jet can separate two adjacent layers having peeling strength therebetween in the range of from 0.01 to 50.0 g/cm. The invention can simplify the procedure and provide high throughput in separating thinned wafer from its carrier.
公开/授权文献
- US09962919B2 Method of separating a carrier-workpiece bonded stack 公开/授权日：2018-05-08
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