Invention Application
- Patent Title: BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND DIE STRUCTURE
- Patent Title (中): 粘结结构，其制造方法和模具结构
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Application No.: US14860721Application Date: 2015-09-22
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Publication No.: US20160336211A1Publication Date: 2016-11-17
- Inventor: Kuan-Wei Chen , Pei-Jer Tzeng , Chien-Chou Chen , Po-Chih Chang
- Applicant: Industrial Technology Research Institute
- Priority: TW104115136 20150513
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/50 ; H01L21/78 ; H01L23/544 ; H01L29/06
Abstract:
A bonding structure including a first substrate, a second substrate, and an adhesive layer is provided. The first substrate has a plurality of first trenches. The adhesive layer is located between the first substrate and the second substrate, and the first trenches are filled with the adhesive layer.
Public/Granted literature
- US09721824B2 Wafer bonding method and device with reduced thermal expansion Public/Granted day:2017-08-01
Information query
IPC分类:
