公开(公告)号：US09721824B2

公开(公告)日：2017-08-01

申请号：US14860721

申请日：2015-09-22

Applicant: Industrial Technology Research Institute

Inventor： Kuan-Wei Chen ,  Pei-Jer Tzeng ,  Chien-Chou Chen ,  Po-Chih Chang

IPC: H01L21/683 ,  H01L29/06 ,  H01L21/78 ,  H01L21/50 ,  H01L23/544

CPC classification number: H01L21/6835 ,  H01L21/50 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L29/0657 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/5446

Abstract: A bonding structure including a first substrate, a second substrate, and an adhesive layer is provided. The first substrate has a plurality of first trenches. The adhesive layer is located between the first substrate and the second substrate, and the first trenches are filled with the adhesive layer.

公开(公告)号：US20160336211A1

公开(公告)日：2016-11-17

申请号：US14860721

申请日：2015-09-22

Applicant: Industrial Technology Research Institute

Inventor： Kuan-Wei Chen ,  Pei-Jer Tzeng ,  Chien-Chou Chen ,  Po-Chih Chang

IPC: H01L21/683 ,  H01L21/50 ,  H01L21/78 ,  H01L23/544 ,  H01L29/06

CPC classification number: H01L21/6835 ,  H01L21/50 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L29/0657 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/5446

Abstract: A bonding structure including a first substrate, a second substrate, and an adhesive layer is provided. The first substrate has a plurality of first trenches. The adhesive layer is located between the first substrate and the second substrate, and the first trenches are filled with the adhesive layer.

Abstract translation: 提供包括第一基板，第二基板和粘合剂层的接合结构。 第一基板具有多个第一沟槽。 粘合剂层位于第一基板和第二基板之间，并且第一沟槽被填充有粘合剂层。

公开(公告)号：US20220367385A1

公开(公告)日：2022-11-17

申请号：US17547200

申请日：2021-12-09

Applicant: Industrial Technology Research Institute

Inventor： Yu-Min Lin ,  Ching-Kuan Lee ,  Chao-Jung Chen ,  Ren-Shin Cheng ,  Ang-Ying Lin ,  Po-Chih Chang

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/15 ,  H01L21/48 ,  H01L21/56

Abstract: A package carrier, including a first redistribution structure layer, multiple conductive connecting members, a connection structure layer, at least one stiffener, and a molding compound, is provided. The conductive connecting members are disposed on a first surface of the first redistribution structure layer and are electrically connected to the first redistribution structure layer. The connection structure layer is disposed on a second surface of the first redistribution structure layer and includes a substrate and multiple pads. A top surface and a bottom surface of each pad are respectively exposed to an upper surface and a lower surface of the substrate. The pads are electrically connected to the first redistribution structure layer. The stiffener is disposed on the first surface and is located at least between the conductive connecting members. The molding compound is disposed on the first surface and covers the conductive connecting members and the stiffener.

公开(公告)号：US12027470B2

公开(公告)日：2024-07-02

申请号：US17547200

申请日：2021-12-09

Applicant: Industrial Technology Research Institute

Inventor： Yu-Min Lin ,  Ching-Kuan Lee ,  Chao-Jung Chen ,  Ren-Shin Cheng ,  Ang-Ying Lin ,  Po-Chih Chang

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/15 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L21/481 ,  H01L21/4846 ,  H01L21/4857 ,  H01L21/56 ,  H01L21/568 ,  H01L23/15 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/14 ,  H01L24/17

Abstract: A package carrier, including a first redistribution structure layer, multiple conductive connecting members, a connection structure layer, at least one stiffener, and a molding compound, is provided. The conductive connecting members are disposed on a first surface of the first redistribution structure layer and are electrically connected to the first redistribution structure layer. The connection structure layer is disposed on a second surface of the first redistribution structure layer and includes a substrate and multiple pads. A top surface and a bottom surface of each pad are respectively exposed to an upper surface and a lower surface of the substrate. The pads are electrically connected to the first redistribution structure layer. The stiffener is disposed on the first surface and is located at least between the conductive connecting members. The molding compound is disposed on the first surface and covers the conductive connecting members and the stiffener.