Invention Application
- Patent Title: METHOD OF FORMING A SEMICONDUCTOR PACKAGE
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Application No.: US15219593Application Date: 2016-07-26
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Publication No.: US20160336280A1Publication Date: 2016-11-17
- Inventor: Jing-Cheng Lin , Chin-Chuan Chang , Jui-Pin Hung
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/065 ; H01L25/00 ; H01L25/10

Abstract:
A method of forming a semiconductor package includes forming an interconnecting structure on an adhesive layer, wherein the adhesive layer is on a carrier. The method further includes placing a semiconductor die on a surface of the interconnecting structure. The method further includes placing a package structure on the surface of the interconnecting structure, wherein the semiconductor die fits in a space between the interconnecting structure and the package structure. The method further includes performing a reflow to bond the package structure to the interconnecting structure.
Public/Granted literature
- US09960125B2 Method of forming a semiconductor package Public/Granted day:2018-05-01
Information query
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