Invention Application
- Patent Title: MICROETCHING SOLUTION FOR COPPER, REPLENISHMENT SOLUTION THEREFOR AND METHOD FOR PRODUCTION OF WIRING BOARD
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Application No.: US15224825Application Date: 2016-08-01
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Publication No.: US20160340788A1Publication Date: 2016-11-24
- Inventor: Masayo KURII , Kiyoto TAI , Mami NAKAMURA
- Applicant: MEC COMPANY LTD.
- Applicant Address: JP Hyogo
- Assignee: MEC COMPANY LTD.
- Current Assignee: MEC COMPANY LTD.
- Current Assignee Address: JP Hyogo
- Priority: JP2012-164006 20120724
- Main IPC: C23F1/18
- IPC: C23F1/18 ; H05K3/00

Abstract:
Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.
Public/Granted literature
- US09932678B2 Microetching solution for copper, replenishment solution therefor and method for production of wiring board Public/Granted day:2018-04-03
Information query
IPC分类: