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公开(公告)号：US20230407486A1
公开(公告)日：2023-12-21
申请号：US18036313
申请日：2021-09-30
Applicant: MEC COMPANY LTD.
Inventor： Yu FUKUI , Daisaku AKIYAMA , Dai NAKANE , Kenji NISHIE
Abstract: The present invention includes an etching agent that selectively etches a copper layer of a processing target in which a noble metal layer containing a metal nobler than copper and the copper layer coexist, the etching agent including: a copper ion; one or more nitrogen-containing compounds selected from the group consisting of a heterocyclic compound having two or more nitrogen atoms in a ring and an amino group-containing compound having 8 or less carbon atoms; a polyalkylene glycol; and a halogen ion, in which the polyalkylene glycol is contained in an amount of 0.0005% by weight or more and 7% by weight or less, and the halogen ion is contained in an amount of 1 ppm or more and 250 ppm or less.
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公开(公告)号：US20220017755A1
公开(公告)日：2022-01-20
申请号：US17188460
申请日：2021-03-01
Applicant: MEC COMPANY LTD.
Inventor： Koki MORIKAWA , Masahiro HAYASHIZAKI , Motohiro NAKANO , Masataka ARAKI
Abstract: Provided are a coating film-forming composition for forming a coating film on a metal surface that exhibits excellent adhesiveness between a metal and a resin, and a surface-treated metal member having a coating film formed by using the composition. The coating film-forming composition is a solution containing a silane coupling agent having an amino group, a metallic ion and a halide ion. The metallic ion is preferably a copper ion, and a copper ion concentration in the solution is preferably 0.1 to 60 mM. The amount of Si based on the amount of Cu in the solution is preferably 30 or less, in terms of molar ratio. The pH of the solution is preferably 2.8 to 6.2.
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3.发明授权公开(公告)号：US11208726B2
公开(公告)日：2021-12-28
申请号：US16646604
申请日：2018-08-20
Applicant: MEC COMPANY LTD.
Inventor： Yuki Ogino , Takahiro Sakamoto , Kaoru Urushibata
Abstract: A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 μm or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.
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4.发明申请公开(公告)号：US20200263308A1
公开(公告)日：2020-08-20
申请号：US16646604
申请日：2018-08-20
Applicant: MEC COMPANY LTD.
Inventor： Yuki OGINO , Takahiro SAKAMOTO , Kaoru URUSHIBATA
Abstract: A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 μm or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.
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5.发明申请公开(公告)号：US20200157394A1
公开(公告)日：2020-05-21
申请号：US16611250
申请日：2018-03-02
Applicant: MEC COMPANY LTD.
Inventor： Itsuro TOMATSU , Kosuke KUMAZAKI , Yasutaka AMITANI , Yuko SHIBANUMA , Ikuyo KATAYAMA
IPC: C09J179/02 , B32B15/08 , B32B15/20 , B32B37/12 , C23C22/06 , C23C22/63 , C23C22/68 , C09J11/04 , C09J5/02 , H05K3/38
Abstract: The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of −1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.
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Patent Agency Ranking
公开(公告)号：US20200040460A1
公开(公告)日：2020-02-06
申请号：US16471126
申请日：2017-12-15
Applicant: MEC COMPANY LTD.
Inventor： Daisaku AKIYAMA , Itsuro TOMATSU , Yasutaka AMITANI , Keisuke JOKO , Tokuya SATOMI
Abstract: The coating film-forming composition is a solution of pH 4 to 10 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and an oxidizing agent. As the oxidizing agent, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, organic peroxides, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The coating film-forming composition is used for, for example, forming a coating film on surface of a metal member.
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7.发明申请公开(公告)号：US20190127606A1
公开(公告)日：2019-05-02
申请号：US16096827
申请日：2017-03-13
Applicant: MEC COMPANY LTD.
Inventor： Daisaku AKIYAMA , Yoichi SENGOKU , Itsuro TOMATSU , Masao OKADA , Ryoko MITANI , Keisuke JOKO , Yasutaka AMITANI , Tokuya SATOMI , Masaru TAKAHASHI
IPC: C09D183/04 , B32B15/08 , C09J11/08 , C09D7/63 , C09J183/04
CPC classification number: C09D183/04 , B32B15/08 , B32B2255/06 , B32B2255/24 , C08K3/16 , C08K5/092 , C08K5/17 , C09D5/00 , C09D5/002 , C09D7/40 , C09D7/61 , C09D7/63 , C09D177/00 , C09J11/04 , C09J11/06 , C09J11/08 , C09J183/04 , C23C26/00 , H05K3/38
Abstract: The coating film-forming composition is a solution of pH 6 to 9 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and a halide ion. The content of polybasic acid in the coating film-forming composition is 0.05 to 10 times the content of aromatic compound, and the halide ion concentration is 5 to 600 mM. A coating film with excellent adhesion to a resin can be formed on a surface of a metal member by bringing the coating film-forming composition into contact with the surface of the metal member.
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公开(公告)号：US10174428B2
公开(公告)日：2019-01-08
申请号：US15124018
申请日：2016-05-31
Applicant: MEC COMPANY LTD.
Inventor： Hirofumi Kodera , Ikuyo Katayama , Shota Hishikawa
Abstract: An etchant for copper includes an acid and one or more compounds selected from the group consisting of an aliphatic noncyclic compound, an aliphatic heterocyclic compound and a heteroaromatic compound. The aliphatic noncyclic compound is a saturated aliphatic noncyclic compound (A) including only two or more nitrogen atoms as heteroatoms, and 2 to 10 carbon atoms. The aliphatic heterocyclic compound is a compound (B) including a five-, six-, or seven-membered ring having one or more nitrogen atoms as one or more heteroatoms constituting the ring. The heteroaromatic compound is a compound (C) including a six-membered heteroaromatic ring having one or more nitrogen atoms as one or more heteroatoms constituting the ring.
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公开(公告)号：US20170268112A1
公开(公告)日：2017-09-21
申请号：US15531764
申请日：2015-09-17
Applicant: MEC COMPANY LTD.
Inventor： Daisaku AKIYAMA , Mina RAIJO
CPC classification number: C23F1/22 , B29C45/02 , B29C45/14 , B29C45/14311 , B29K2705/00
Abstract: The etching agent is an aqueous solution including at least one acid selected from the group consisting of inorganic acids other than nitric acid, and organic acids; and an organic nitrogen compound having a molecular structure containing N—OH or N—O−. The acid concentration of the etching agent is 0.05 to 3% by weight, and the organic nitrogen compound concentration of the etching agent is 0.005 to 5% by weight. By bringing the etching agent into contact with a surface of a magnesium component, fine irregularities can be formed on the surface of the magnesium component even when etching depth is large.
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公开(公告)号：US08147631B2
公开(公告)日：2012-04-03
申请号：US12708657
申请日：2010-02-19
Applicant: Mutsuyuki Kawaguchi , Tsuyoshi Amatani
Inventor： Mutsuyuki Kawaguchi , Tsuyoshi Amatani
IPC: B32B41/00
CPC classification number: H05K3/389 , B32B37/203 , B32B38/0012 , B32B2037/243 , B32B2038/168 , B32B2309/02 , B32B2309/04 , B32B2457/00 , H05K1/0269 , H05K3/022 , H05K2201/0355 , H05K2203/1476 , H05K2203/163
Abstract: The method for forming a laminate of the present invention is a method for forming a laminate, comprising a silane coupling agent treatment step of applying an aqueous solution of a silane coupling agent onto a surface of a metal layer, and drying the resultant applied film to form a silane coupling agent coating, and a lamination step of laminating a resin layer on the silane coupling agent coating, these steps being continuously performed, wherein when the formed silane coupling agent coating is analyzed in the silane coupling agent treatment step by FT-IR with a reflection absorption spectrometry and then the peak area of Si—O is turned to a value less than a predetermined threshold value, at least one part of the aqueous solution of the silane coupling agent is renewed, thereby conducting the silane coupling agent treatment while the peak area is controlled into a predetermined range.
Abstract translation: 本发明的层叠体的形成方法是层叠体的形成方法，其包括将硅烷偶联剂的水溶液涂布在金属层的表面上的硅烷偶联剂处理工序，将所得的涂膜干燥 形成硅烷偶联剂涂层，以及在硅烷偶联剂涂层上层叠树脂层的层压步骤，连续进行这些步骤，其中当通过FT-IR在硅烷偶联剂处理步骤中分析形成的硅烷偶联剂涂层时 利用反射吸收光谱法，然后将Si-O的峰面积变为小于预定阈值的值，至少一部分硅烷偶联剂的水溶液被更新，从而进行硅烷偶联剂处理，同时 将峰面积控制在预定范围内。
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