Invention Application
US20160346795A1 NOZZLE, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND SUBSTRATE TREATING METHOD
审中-公开
喷嘴，包括其的基板处理装置和基板处理方法
- Patent Title: NOZZLE, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND SUBSTRATE TREATING METHOD
- Patent Title (中): 喷嘴，包括其的基板处理装置和基板处理方法
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Application No.: US15160136Application Date: 2016-05-20
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Publication No.: US20160346795A1Publication Date: 2016-12-01
- Inventor: Kihoon CHOI , Yoon Jong Ju , Byung Man Kang
- Applicant: Semes Co., Ltd.
- Applicant Address: KR Cheonan-si
- Assignee: Semes Co., Ltd.
- Current Assignee: Semes Co., Ltd.
- Current Assignee Address: KR Cheonan-si
- Priority: KR10-2015-0076229 20150529
- Main IPC: B05B1/08
- IPC: B05B1/08 ; B08B3/02 ; B08B3/08 ; B05B1/18 ; B08B3/10
Abstract:
Disclosed is a nozzle for supplying a treatment liquid to a substrate, the nozzle including a body having a passage, through which the treatment liquid flows, in the interior thereof, and having a discharge hole communicated with the passage and through which the treatment liquid is discharged, and a piezoelectric element that pressurize the treatment liquid flowing through the body to discharge the treatment liquid through the discharge hole in a state of droplets, wherein an average diameter of the droplets discharged through the discharge hole is equal to or greater than 5 micrometers and is less than 15 micrometers.
Information query
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