SUBSTRATE PROCESSING APPARATUS
    1.
    发明申请

    公开(公告)号:US20250069908A1

    公开(公告)日:2025-02-27

    申请号:US18779123

    申请日:2024-07-22

    Abstract: A substrate processing apparatus includes a support unit configured to support a substrate and be rotatable, a chemical liquid supply nozzle configured to supply a chemical liquid to a chemical liquid supply area of the substrate, and a charging unit disposed adjacent to the substrate. The charging unit is disposed adjacent to the chemical liquid supply nozzle, and is charged with charges opposite to charges of the chemical liquid.

    Apparatus for controlling flow rate and method of controlling flow rate

    公开(公告)号:US12235663B2

    公开(公告)日:2025-02-25

    申请号:US17742281

    申请日:2022-05-11

    Abstract: A flow rate control apparatus with improved reliability is provided. The flow rate control apparatus comprises a flow rate measuring unit for measuring a flow rate of chemical solution in a chemical solution supply line, a flow rate control unit for comparing a preset target flow rate profile and an applied flow rate profile, and controlling the flow rate of the chemical solution so that the applied flow rate profile matches the target flow rate profile, and a processor for switching the flow rate control unit to a first mode in response to a signal for the flow rate of the chemical solution measured by the flow rate measuring unit being less than a preset level, wherein, in the first mode, the applied flow rate profile includes a profile of a flow rate estimation model simulated using a flow rate of chemical solution measured by the flow rate measuring unit.

    Substrate treating apparatus and substrate treating method

    公开(公告)号:US12230516B2

    公开(公告)日:2025-02-18

    申请号:US17515737

    申请日:2021-11-01

    Abstract: The inventive concept relates to a substrate treating apparatus including a process chamber having a first and a second body, a support unit supporting a substrate, a heating unit heats the substrate, a driver moves any one of the first body and the second body, an interval state detection unit that detects an interval state between a side wall of the first body and a side wall of the second body when the first and the second body are placed in a process location, and a controller that controls the driver and the interval state detection unit, wherein the interval state detection unit includes a pressure provision line that provides a positive pressure or a negative pressure between the side wall of the first body and the side wall of the second body, and a pressure measurement member that measures a change in a pressure of the pressure provision line.

    Substrate processing apparatus and method

    公开(公告)号:US12221296B2

    公开(公告)日:2025-02-11

    申请号:US18458252

    申请日:2023-08-30

    Inventor: Ho Chul Choi

    Abstract: Provided is a substrate processing apparatus and method capable of controlling a gripper to stably suck a substrate even when the substrate is deformed, the substrate processing apparatus including a floating stage for floating a substrate, lift pins liftably mounted in the floating stage, a substrate aligner for aligning the substrate floated from the floating stage, a gripper for vacuum-sucking the aligned substrate, and a controller capable of controlling a floating height of the substrate, wherein the controller reduces the floating height of the substrate when the gripper fails to vacuum-suck the substrate.

    SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

    公开(公告)号:US20250046631A1

    公开(公告)日:2025-02-06

    申请号:US18792709

    申请日:2024-08-02

    Abstract: Disclosed is a substrate treating apparatus including: a treating chamber for treating a substrate; a transfer unit for loading and unloading the substrate into and from a treatment space in which the substrate is treated in the treating chamber; and a heating unit provided to be loaded into and unloaded from the treatment space, and for cleaning the treatment space by heating, in which the treating chamber includes: a chamber body providing the treatment space; and a support unit for supporting the substrate within the treatment space; and a fluid supply unit for supplying a fluid, which treats the substrate, into the treatment space, and the heating unit includes: a base; and a heater installed on the base.

    Apparatus for treating a substrate
    10.
    发明授权

    公开(公告)号:US12205837B2

    公开(公告)日:2025-01-21

    申请号:US17704195

    申请日:2022-03-25

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber configured to treat a substrate; a transfer assembly configured to transfer the substrate to the process chamber; and a diagnosis unit configured to detect an abnormal state of the transfer assembly, and wherein the transfer assembly comprises: a housing having a transfer space; and a transfer robot configured to transfer the substrate to the process chamber, and wherein the diagnosis unit comprises: a detection member for detecting an air vibration generated within the housing; and a diagnosis member for diagnosing a driving unit of the transfer assembly based on the air vibration detected by the detection member.

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