A laser processing system and method for cutting individual parts from a continuous moving web of substrate material. The laser system is configured to cleanly cut individual parts from a moving web without severing or damaging a supporting conveyor belt by partially processing the substrate as the substrate passes over a first conveyor belt comprising a plurality of individual belts spaced apart across the width of the web. The laser is directed to process the substrate according to gaps in the apparatus below the substrate, that is the laser is configured to process the substrate along a path wherein the substrate is passed over air rather than a physical support or conveyor. The finishing of the singulation of the individual part is completed by laser processing the web as it passes over a gap between a first conveyor and a second conveyor system.