Invention Application
US20160351514A1 WIRELESS IC DEVICE, RESIN MOLDED BODY COMPRISING SAME, COMMUNICATION TERMINAL APPARATUS COMPRISING SAME, AND METHOD OF MANUFACTURING SAME
审中-公开
无线IC装置，包含其的树脂模制体，包含其的通信终端装置及其制造方法
- Patent Title: WIRELESS IC DEVICE, RESIN MOLDED BODY COMPRISING SAME, COMMUNICATION TERMINAL APPARATUS COMPRISING SAME, AND METHOD OF MANUFACTURING SAME
- Patent Title (中): 无线IC装置，包含其的树脂模制体，包含其的通信终端装置及其制造方法
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Application No.: US15234227Application Date: 2016-08-11
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Publication No.: US20160351514A1Publication Date: 2016-12-01
- Inventor: Naoto IKEDA , Shunji MANDAI , Yoichi SAITO
- Applicant: Murata Manufacturing Co., Ltd.
- Priority: JP2015-045170 20150306
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/00 ; H01L21/48 ; H01L23/498 ; H01L23/31
Abstract:
A wireless IC device includes an element body including first and second principal surfaces, an RFIC element buried in the element body, and an antenna coil disposed in the element body. The antenna coil includes a first wiring pattern provided on the second principal surface, a first metal pin reaching the first principal surface and the second principal surface, a second metal pin reaching the first principal surface and the second principal surface, and a second wiring pattern provided on the first principal surface. Terminal surfaces of the first input/output terminal and the second input/output terminal of the RFIC element face the second principal surface of the element body and are spaced away from the antenna coil while being connected to the first wiring pattern through first and second conductors extending from the second principal surface of the element body in a direction of the first primary surface.
Public/Granted literature
Information query
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