Invention Application
- Patent Title: DUAL MOLDED STACK TSV PACKAGE
- Patent Title (中): 双模堆叠TSV包装
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Application No.: US14730171Application Date: 2015-06-03
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Publication No.: US20160358889A1Publication Date: 2016-12-08
- Inventor: Kwan-Yu Lai , Jun Zhai , Kunzhong Hu , Flynn P. Carson
- Applicant: Apple Inc.
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/31 ; H01L21/768 ; H01L21/56 ; H01L25/00 ; H01L23/48 ; H01L23/528
Abstract:
Packages including an embedded die with through silicon vias (TSVs) are described. In an embodiment, a first level die including TSVs is embedded between a first redistribution layer (RDL) and a second RDL, and a second level die is mounted on a top side of the first redistribution layer. In an embodiment, the first level die is an active die, less than 50 μm thick.
Public/Granted literature
- US09679801B2 Dual molded stack TSV package Public/Granted day:2017-06-13
Information query
IPC分类:
