Invention Application
- Patent Title: ATOMIC LAYER DEPOSITION PROCESSING CHAMBER PERMITTING LOW-PRESSURE TOOL REPLACEMENT
- Patent Title (中): 原子层沉积加工室允许低压工具更换
-
Application No.: US15107878Application Date: 2015-01-20
-
Publication No.: US20160362788A1Publication Date: 2016-12-15
- Inventor: Shinichi KURITA , Jozef KUDELA , John M. WHITE , Dieter HAAS
- Applicant: APPLIED MATERIALS, INC.
- International Application: PCT/US2015/011945 WO 20150120
- Main IPC: C23C16/455
- IPC: C23C16/455 ; H01L51/52 ; H01L51/56
Abstract:
The present disclosure relates to methods and apparatus for an atomic layer deposition (ALD) processing chamber for device fabrication and methods for replacing a gas distribution plate and mask of the same. The ALD processing chamber has a slit valve configured to allow removal and replacement of a gas distribution plate and mask. The ALD processing chamber may also have actuators operable to move the gas distribution plate to and from a process position and a substrate support assembly operable to move the mask to and from a process position.
Public/Granted literature
- US10184179B2 Atomic layer deposition processing chamber permitting low-pressure tool replacement Public/Granted day:2019-01-22
Information query
IPC分类:
