Invention Application
- Patent Title: SUBSTRATE INSPECTION DEVICE AND METHOD
- Patent Title (中): 基板检查装置及方法
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Application No.: US14895703Application Date: 2015-07-17
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Publication No.: US20160363791A1Publication Date: 2016-12-15
- Inventor: Yongjin LEE , Unsub LEE , Tae Hyuck YOON
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD
- Priority: CN201410803896.7 20141218
- International Application: PCT/CN2015/084373 WO 20150717
- Main IPC: G02F1/13
- IPC: G02F1/13 ; G01N21/95 ; G06T7/00 ; H04N7/18 ; H04N5/225

Abstract:
A substrate inspection device and method are disclosed. The substrate inspection device includes a conveyance stage for carrying the substrate on its surface; a region scanning camera located at a first side of the conveyance stage, provided to be opposite to the surface, and configured for inspecting standard specification of the substrate; a line scanning camera located at the first side of the conveyance stage, provided to be opposite to the surface, and configured for inspecting edge line and size of the substrate; and a light source located at a second side of the conveyance stage opposite to the first side, configured for irradiating light rays onto the substrate, so as to be utilized by the region scanning camera and the line scanning camera for inspecting the substrate.
Public/Granted literature
- US09880408B2 Substrate inspection device and method Public/Granted day:2018-01-30
Information query