Invention Application
- Patent Title: WIRING BOARD AND ELECTRONIC COMPONENT DEVICE
- Patent Title (中): 接线板和电子元器件
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Application No.: US15174440Application Date: 2016-06-06
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Publication No.: US20160365327A1Publication Date: 2016-12-15
- Inventor: Tomoyuki Shimodaira , Takahiro Rokugawa , Hitoshi Kondo
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Priority: JP2015-116522 20150609
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/48 ; H01L21/56 ; H01L23/31
Abstract:
A wiring board includes: an insulating layer; a pad including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the side surface and the lower surface of the pad are embedded in the insulating layer; and a metal post formed on the upper surface of the pad and including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein a narrowed portion is formed in the side surface of the metal post.
Public/Granted literature
- US09711476B2 Wiring board and electronic component device Public/Granted day:2017-07-18
Information query
IPC分类:
