公开(公告)号：US20230089948A1

公开(公告)日：2023-03-23

申请号：US17947489

申请日：2022-09-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takashi Kasuga ,  Tomoyuki Shimodaira ,  Hikaru Tanaka ,  Naotaka Noguchi ,  Takashi Sato ,  Hitoshi Kondo

IPC: H05K1/11

Abstract: A wiring board includes: a wiring layer; an insulating layer laminated on the wiring layer; an opening portion penetrating through the insulating layer to the wiring layer; a recess portion formed in a surface of the wiring layer exposed from the opening portion of the insulating layer; and a conductor film formed in the opening portion of the insulating layer and the recess portion of the wiring layer, wherein the recess portion of the wiring layer includes a raised portion, which is raised higher than an outer peripheral portion of a bottom surface, at a central portion of the bottom surface.

公开(公告)号：US09905504B1

公开(公告)日：2018-02-27

申请号：US15714391

申请日：2017-09-25

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Junji Sato ,  Hitoshi Kondo ,  Katsuya Fukase

IPC: H05K1/14 ,  H01L23/498 ,  H01L23/13 ,  H01L21/683 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L21/66

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L22/14 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/16227 ,  H01L2924/3511

Abstract: A carrier base material-added wiring substrate includes a wiring substrate and first to third carrier base materials. The first carrier base material is adhered by a first adhesive layer to a lower surface of the wiring substrate and includes an opening that exposes a product area of the wiring substrate. The second carrier base material is arranged in the opening of the first carrier base material and contacts the lower surface of the wiring substrate. The third carrier base material is adhered by a second adhesive layer to the first carrier base material and the second carrier base material. The third carrier base material covers the opening of the first carrier base material. The second adhesive layer is formed entirely on an upper surface of the third carrier base material.

公开(公告)号：US09711476B2

公开(公告)日：2017-07-18

申请号：US15174440

申请日：2016-06-06

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Tomoyuki Shimodaira ,  Takahiro Rokugawa ,  Hitoshi Kondo

IPC: H01L21/00 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L24/16 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/562 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/11614 ,  H01L2224/11831 ,  H01L2224/13007 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/14133 ,  H01L2224/14135 ,  H01L2224/16014 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32237 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/15313 ,  H01L2924/351 ,  H01L2924/3512 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0665 ,  H01L2924/00014

Abstract: A wiring board includes: an insulating layer; a pad including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the side surface and the lower surface of the pad are embedded in the insulating layer; and a metal post formed on the upper surface of the pad and including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein a narrowed portion is formed in the side surface of the metal post.

公开(公告)号：US10510649B1

公开(公告)日：2019-12-17

申请号：US16418168

申请日：2019-05-21

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Yoshihiro Kita ,  Hitoshi Kondo

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/09 ,  H05K1/02

Abstract: An interconnect substrate includes an insulating layer having a first resin layer and a second resin layer covering an upper surface of the first resin layer, a first conductive layer having an upper surface and side surfaces covered with the first resin layer, a lower surface of the first conductive layer being exposed from a lower surface of the first resin layer, and a second conductive layer including an interconnect pattern and a via interconnect, the interconnect pattern being disposed on an upper surface of the second resin layer, the via interconnect penetrating through both the second resin layer and the first resin layer to connect the interconnect pattern to the upper surface of the first conductive layer, wherein the first resin layer is made of a resin having a higher modulus of elasticity and a lower coefficient of elongation than the second resin layer.

公开(公告)号：US10340214B2

公开(公告)日：2019-07-02

申请号：US15714307

申请日：2017-09-25

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Junji Sato ,  Hitoshi Kondo ,  Katsuya Fukase

IPC: H01L23/498 ,  H05K3/34 ,  H01L21/48 ,  H01L21/683 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/66

Abstract: A carrier base material-added wiring substrate includes a wiring substrate and a carrier base material. The wiring substrate includes an insulation layer, a wiring layer arranged on a lower surface of the insulation layer, and a solder resist layer that covers the lower surface of the insulation layer and includes an opening that exposes a portion of the wiring layer as an external connection terminal. The carrier base material is adhered by an adhesive layer to the solder resist layer. The carrier base material includes an opening that is in communication with the opening of the solder resist layer and exposes the external connection terminal. The opening of the carrier base material has a diameter that is smaller than that of the opening of the solder resist layer.

公开(公告)号：US20160365327A1

公开(公告)日：2016-12-15

申请号：US15174440

申请日：2016-06-06

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Tomoyuki Shimodaira ,  Takahiro Rokugawa ,  Hitoshi Kondo

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L24/16 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/562 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/11614 ,  H01L2224/11831 ,  H01L2224/13007 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/14133 ,  H01L2224/14135 ,  H01L2224/16014 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32237 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/15313 ,  H01L2924/351 ,  H01L2924/3512 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0665 ,  H01L2924/00014

Abstract: A wiring board includes: an insulating layer; a pad including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the side surface and the lower surface of the pad are embedded in the insulating layer; and a metal post formed on the upper surface of the pad and including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein a narrowed portion is formed in the side surface of the metal post.

Abstract translation: 布线板包括：绝缘层; 垫，包括：上表面; 与上表面相对的下表面; 以及所述上表面和所述下表面之间的侧表面，其中所述垫的侧表面和所述下表面嵌入所述绝缘层中; 以及形成在所述垫的上表面上的金属柱，并且包括：上表面; 与上表面相对的下表面; 以及上表面和下表面之间的侧表面，其中在金属柱的侧表面中形成有窄部。

公开(公告)号：US12191255B2

公开(公告)日：2025-01-07

申请号：US18046557

申请日：2022-10-14

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Hikaru Tanaka ,  Takashi Kasuga ,  Tomoyuki Shimodaira ,  Hitoshi Kondo

IPC: H01L23/532 ,  H01L23/482 ,  H01L23/522

Abstract: An interconnect substrate includes a pad for external connection and an insulating layer, wherein a portion of a lower surface of the pad is covered with the insulating layer, wherein an upper surface of the pad is situated at a lower position than an upper surface of the insulating layer, and wherein a groove whose bottom surface is formed by the insulating layer is formed around the pad in a plan view, and has an opening on an upper surface side of the insulating layer.

公开(公告)号：US11001930B2

公开(公告)日：2021-05-11

申请号：US16905096

申请日：2020-06-18

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Tomoyuki Shimodaira ,  Hitoshi Kondo

IPC: C23F1/00 ,  H05K3/46 ,  H05K3/00 ,  B81C1/00 ,  H01L21/3213

Abstract: A method of manufacturing a wiring board, includes forming an interconnect layer on a first insulating layer, roughening a surface of the interconnect layer, not in contact with the first insulating layer, to form concavo-convex portions, forming a bond enhancing film on the concavo-convex portions, partially removing the bond enhancing film, using an acid solution, and forming a second insulating layer on the first insulating layer, to cover the interconnect layer.

公开(公告)号：US10398027B2

公开(公告)日：2019-08-27

申请号：US16207446

申请日：2018-12-03

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kazuhiro Oshima ,  Junji Sato ,  Hitoshi Kondo ,  Katsuya Fukase

IPC: H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31

Abstract: A wiring board includes: a wiring structure including: a first insulating layer; a first wiring layer formed on a bottom surface of the first insulating layer; and a protective insulating layer which covers the bottom surface of the first insulating layer and has a first opening; and a support base member bonded to the protective insulating layer with an adhesive layer and has a second opening. A diameter of the second opening at a position between the top surface and the bottom surface of the support base member in a thickness direction of the support base member is smaller than a diameter of the second opening at the top surface of the support base member and a diameter of the second opening at the bottom surface of the support base member, and smaller than a diameter of the first opening.

公开(公告)号：US20190181084A1

公开(公告)日：2019-06-13

申请号：US16207446

申请日：2018-12-03

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kazuhiro Oshima ,  Junji Sato ,  Hitoshi Kondo ,  Katsuya Fukase

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00

CPC classification number: H05K1/0298 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16227 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2224/81

Abstract: A wiring board includes: a wiring structure including: a first insulating layer; a first wiring layer formed on a bottom surface of the first insulating layer; and a protective insulating layer which covers the bottom surface of the first insulating layer and has a first opening; and a support base member bonded to the protective insulating layer with an adhesive layer and has a second opening. A diameter of the second opening at a position between the top surface and the bottom surface of the support base member in a thickness direction of the support base member is smaller than a diameter of the second opening at the top surface of the support base member and a diameter of the second opening at the bottom surface of the support base member, and smaller than a diameter of the first opening.