Invention Application
- Patent Title: SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 半导体结构及其制造方法
-
Application No.: US14792591Application Date: 2015-07-06
-
Publication No.: US20160365344A1Publication Date: 2016-12-15
- Inventor: Li-Wei Feng , Shih-Hung Tsai , Hon-Huei Liu , Chao-Hung Lin , Nan-Yuan Huang , Jyh-Shyang Jenq
- Applicant: United Microelectronics Corp.
- Priority: CN201510311627.3 20150609
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/306 ; H01L21/762 ; H01L29/06 ; H01L21/8234

Abstract:
The present invention provides a semiconductor structure, including a substrate having a first fin structure and a second fin structure disposed thereon, a first isolation region located between the first fin structure and the second fin structure, a second isolation region located opposite the first fin structure from the first isolation region, and at least an epitaxial layer disposed on the side of the first fin structure and the second fin structure. The epitaxial layer has a bottom surface, the bottom surface extending from the first fin structure to the second fin structure, and the bottom surface is lower than a bottom surface of the first isolation region and a top surface of the second isolation region.
Public/Granted literature
- US09502410B1 Semiconductor structure and manufacturing method thereof Public/Granted day:2016-11-22
Information query
IPC分类: