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发明申请
US20160369032A1 COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD 有权
含酚羟基，酚醛树脂，可固化组合物，其固化产品，半导体密封材料和印刷电路板

  • 专利标题： COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD
  • 专利标题（中）： 含酚羟基，酚醛树脂，可固化组合物，其固化产品，半导体密封材料和印刷电路板
  • 申请号： US14900296
    申请日： 2014-02-27
  • 公开(公告)号： US20160369032A1
    公开(公告)日： 2016-12-22
  • 发明人: Yutaka Satou , Ayumi Takahashi
  • 申请人： DIC CORPORATION
  • 优先权： JP2013-133783 20130626
  • 国际申请： PCT/JP2014/054920 WO 20140227
  • 主分类号： C08G8/02
  • IPC分类号： C08G8/02 ;  H05K1/09 ;  H05K1/03 ;  H01L23/29 ;  C07D307/92 ;  C08L63/04
COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD
摘要：
There are provided a compound containing a phenolic hydroxyl group which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product, a phenolic resin including the same, a curable composition and a cured product thereof, and a semiconductor sealing material. The compound containing a phenolic hydroxyl group has a dinaphthofuran skeleton, in which each of the two naphthylene skeletons has a hydroxyl group on an aromatic nucleus thereof.
摘要（中）：

提供了含有酚羟基的化合物，其表现出优异的耐热性和固化产物的阻燃性，含酚醛树脂的酚醛树脂，固化性组合物及其固化物，以及半导体密封材料。 含有酚羟基的化合物具有二萘并呋喃骨架，其中两个亚萘基骨架中的每一个在其芳香核上具有羟基。

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