Invention Application
- Patent Title: CHIP PACKAGES WITH REDUCED TEMPERATURE VARIATION
- Patent Title (中): 具有降低温度变化的芯片封装
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Application No.: US14745800Application Date: 2015-06-22
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Publication No.: US20160372396A1Publication Date: 2016-12-22
- Inventor: Hanyi Ding , Vibhor Jain , Alvin J. Joseph , Anthony K. Stamper
- Applicant: GLOBALFOUNDRIES INC.
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L21/48 ; H01L29/08 ; H01L29/73 ; H01L29/66
Abstract:
Chip packages and methods of forming a chip package. The chip package includes a power amplifier and a thermal pathway structure configured to influence transport of heat energy. The power amplifier includes a first emitter finger and a second emitter finger having at least one parameter that is selected based upon proximity to the thermal pathway structure.
Information query
IPC分类:
