A scratch on a substrate held by a wafer holding unit or adhesion of an impurity to the substrate can be suppressed. A substrate processing apparatus 1 includes a wafer holding unit 22 configured to be rotated and a nozzle 50 configured to supply a coating liquid 50a. The wafer holding unit 22 includes a holding surface 23 and an opening 24. The coating liquid 50a is supplied onto a peripheral portion of the holding surface 23 from the nozzle 50, and then, the coating liquid is dried, so that an annular coating film 25, on which a wafer W is placed, is formed on the holding surface 23.