发明申请
US20160379775A1 KEYBOARD ASSEMBLIES HAVING REDUCED THICKNESSES AND METHOD OF FORMING KEYBOARD ASSEMBLIES
审中-公开
具有减小厚度的键盘组件和形成键盘组件的方法
- 专利标题: KEYBOARD ASSEMBLIES HAVING REDUCED THICKNESSES AND METHOD OF FORMING KEYBOARD ASSEMBLIES
- 专利标题(中): 具有减小厚度的键盘组件和形成键盘组件的方法
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申请号: US15262249申请日: 2016-09-12
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公开(公告)号: US20160379775A1公开(公告)日: 2016-12-29
- 发明人: Craig C. Leong , Bradford J. Zercoe , Thai Q. La , Robert Y. Cao , Alex J. Lehmann , Dinesh C. Mathew
- 申请人: Apple Inc.
- 主分类号: H01H13/7065
- IPC分类号: H01H13/7065 ; H01H13/10 ; G06F1/16 ; H01H13/88
摘要:
Keyboard assemblies having reduced thicknesses and methods of forming the same. A keyboard assembly may include a printed circuit board (PCB) and a single membrane sheet adhered directly to the PCB. The single membrane sheet may substantially cover the PCB. The keyboard assembly may also include a group of dome switches coupled directly to the single membrane sheet. Another keyboard assembly may include a group of conductive pads and a group of membrane pads. Each of the group of membrane pads may be adhered directly to a corresponding one of the group of conductive pads. The keyboard assembly may also include a group of dome switches coupled directly to the membrane pads. Each of the group of dome switches may be coupled directly to a corresponding one of the group of membrane pads.
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