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    KEYBOARD ASSEMBLIES HAVING REDUCED THICKNESSES AND METHOD OF FORMING KEYBOARD ASSEMBLIES
    2.
    发明申请
    KEYBOARD ASSEMBLIES HAVING REDUCED THICKNESSES AND METHOD OF FORMING KEYBOARD ASSEMBLIES 审中-公开
    具有减小厚度的键盘组件和形成键盘组件的方法

    公开(公告)号：US20160379775A1

    公开(公告)日：2016-12-29

    申请号：US15262249

    申请日：2016-09-12

    Applicant: Apple Inc.

    Inventor： Craig C. Leong ,  Bradford J. Zercoe ,  Thai Q. La ,  Robert Y. Cao ,  Alex J. Lehmann ,  Dinesh C. Mathew

    IPC: H01H13/7065 ,  H01H13/10 ,  G06F1/16 ,  H01H13/88

    CPC classification number: H01H13/7065 ,  G06F1/1662 ,  H01H3/125 ,  H01H13/10 ,  H01H13/702 ,  H01H13/807 ,  H01H13/88 ,  H01H2203/028 ,  H01H2205/026 ,  H01H2215/006 ,  H01H2231/002

    Abstract: Keyboard assemblies having reduced thicknesses and methods of forming the same. A keyboard assembly may include a printed circuit board (PCB) and a single membrane sheet adhered directly to the PCB. The single membrane sheet may substantially cover the PCB. The keyboard assembly may also include a group of dome switches coupled directly to the single membrane sheet. Another keyboard assembly may include a group of conductive pads and a group of membrane pads. Each of the group of membrane pads may be adhered directly to a corresponding one of the group of conductive pads. The keyboard assembly may also include a group of dome switches coupled directly to the membrane pads. Each of the group of dome switches may be coupled directly to a corresponding one of the group of membrane pads.

    Abstract translation: 具有减小厚度的键盘组件及其形成方法。 键盘组件可以包括印刷电路板（PCB）和直接粘附到PCB的单个膜片。 单个膜片可以基本上覆盖PCB。 键盘组件还可以包括直接耦合到单个薄膜片的一组圆顶开关。 另一个键盘组件可以包括一组导电垫和一组膜垫。 一组膜垫中的每一个可以直接粘附到一组导电垫中的对应的一个。 键盘组件还可以包括直接耦合到膜垫的一组圆顶开关。 一组圆顶开关中的每一个可以直接耦合到一组膜垫中的对应的一个。

    Illuminated low-travel key mechanism for a keyboard
    6.
    发明授权
    Illuminated low-travel key mechanism for a keyboard 有权

    公开(公告)号：US10468211B2

    公开(公告)日：2019-11-05

    申请号：US15851355

    申请日：2017-12-21

    Applicant: Apple Inc.

    Inventor： Craig C. Leong ,  Robert Y. Cao ,  Bradford J. Zercoe ,  Dinesh C. Mathew ,  Bruce E. Berg

    IPC: G06F3/02 ,  H01H13/705 ,  H01H13/88 ,  H01H13/10 ,  H01H13/85 ,  H01H13/86 ,  G06F1/16 ,  H01H3/12

    Abstract: A key mechanism for an electronic device includes a switch housing and a hinged structure. As one example, the hinged structure can be a butterfly hinge. The switch housing includes switch pin retaining mechanisms on opposing sides of the switch housing. The hinged structure includes two separate wings that are positioned adjacent to each other such that a cavity is formed between the two wings. The two wings are coupled together by coupling elements. The wings of the hinged structure can include switch housing pins on each arm of the wing that extend into the cavity and couple to the switch pin retaining mechanisms in the switch housing. Various configurations of switch pin retaining mechanisms and switch housing pins can be used to attach the hinged structure to the switch housing.

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