Invention Application
US20160379909A1 EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME
有权
用于封装半导体器件的环氧树脂组合物和使用其制备的半导体器件
- Patent Title: EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME
- Patent Title (中): 用于封装半导体器件的环氧树脂组合物和使用其制备的半导体器件
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Application No.: US15188454Application Date: 2016-06-21
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Publication No.: US20160379909A1Publication Date: 2016-12-29
- Inventor: Jin Min CHEON , Ki Hyeok KWON , Min Gyum KIM , Joo Young CHUNG , Jin Woo CHOI , Seung HAN
- Applicant: SAMSUNG SDI CO., LTD.
- Priority: KR10-2015-0089335 20150623
- Main IPC: H01L23/29
- IPC: H01L23/29 ; C09D7/12 ; C09D163/00
Abstract:
An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4:
Public/Granted literature
Information query
IPC分类:
