公开(公告)号：US20170018473A1

公开(公告)日：2017-01-19

申请号：US15209871

申请日：2016-07-14

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Ki Hyeok KWON ,  Min Gyum KIM ,  Joo Young CHUNG ,  Jin Min CHEON ,  Jin Woo CHOI ,  Seung HAN ,  Dong Hwan LEE

IPC: H01L23/29 ,  C07F7/04 ,  C09J163/00 ,  C08K3/36 ,  C08K3/04 ,  C08L63/00 ,  H01L21/56 ,  C07F9/54

CPC classification number: C09J163/00 ,  C07F7/045 ,  C07F9/5442 ,  C08L63/00 ,  C08L2201/08 ,  C08L2203/206 ,  C09J2203/326 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:

公开(公告)号：US20160368937A1

公开(公告)日：2016-12-22

申请号：US15189057

申请日：2016-06-22

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Dong Hwan LEE ,  Min Gyum KIM ,  So Yoon KIM ,  Woo Chul NA ,  Yoon Man LEE ,  Ji Yoon CHO ,  Ki Hyeok KWON ,  KyoungChul BAE ,  Eun Jung LEE ,  Joo Young CHUNG ,  Jin Min CHEON ,  Jin Woo CHOI ,  Seung HAN

IPC: C07F9/54 ,  H01L23/29 ,  C07C235/56 ,  C09D163/00 ,  C09D7/12

CPC classification number: C07F9/5442 ,  C07C235/64 ,  C08G59/621 ,  C08G59/688 ,  C09D163/00 ,  H01L23/295 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:

公开(公告)号：US20160115184A1

公开(公告)日：2016-04-28

申请号：US14918916

申请日：2015-10-21

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Min Gyum KIM ,  Ki Hyeok KWON ,  Dong Hwan LEE ,  Joo Young CHUNG ,  Jin Min CHEON ,  Jin Woo CHOI

IPC: C07F9/54 ,  C09D163/00 ,  H01L23/29 ,  C07C233/65

CPC classification number: C07F9/5442 ,  C07C39/08 ,  C07C39/12 ,  C07C39/17 ,  C07C233/65 ,  C07C235/64 ,  C07C235/66 ,  C07C259/10 ,  C07C323/20 ,  C07C2603/18 ,  C08G59/621 ,  C08G59/688 ,  C08K5/49 ,  C08K5/50 ,  C09D163/00 ,  H01L23/295 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/92125 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1:

Abstract translation: 鏻化合物，环氧树脂组合物，鏻化合物的制备方法以及用环氧树脂组合物包封的半导体器件，由式1表示的化合物：

公开(公告)号：US20170306079A1

公开(公告)日：2017-10-26

申请号：US15523501

申请日：2016-01-22

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Min Gyum KIM ,  Jin Woo CHOI ,  Ki Hyeok KWON ,  Dong Hwan LEE ,  Joo Young CHUNG ,  Jin Min CHEON

IPC: C08G59/68 ,  H01L23/29 ,  C08K3/36 ,  C07F9/54 ,  C07C255/53 ,  C07C49/83 ,  C07C39/15 ,  H01L23/31 ,  C07C39/10

CPC classification number: C08G59/688 ,  C07C39/08 ,  C07C39/10 ,  C07C39/15 ,  C07C39/17 ,  C07C39/235 ,  C07C49/83 ,  C07C255/53 ,  C07C2603/18 ,  C07F9/5442 ,  C08K3/36 ,  H01L23/293 ,  H01L23/3107 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/18161

Abstract: The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.

公开(公告)号：US20170002192A1

公开(公告)日：2017-01-05

申请号：US15200009

申请日：2016-07-01

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Joo Young CHUNG ,  Ki Hyeok KWON ,  Min Gyum KIM ,  Jin Min CHEON ,  Jin Woo CHOI ,  Seung HAN

IPC: C08L63/00 ,  H01L23/29 ,  H01L21/56 ,  C08G59/68

CPC classification number: H01L23/296 ,  C08G59/688 ,  C08G77/14 ,  C08K5/49 ,  C08K5/50 ,  C08L83/04 ,  C08L83/06 ,  C08L83/08 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012

Abstract: An epoxy resin composition and a semiconductor device, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a silicon compound, wherein the curing catalyst includes a phosphonium compound represented by the following Formula 4 and the silicon compound comprises a silicon compound represented by the following Formula 7:

公开(公告)号：US20160379909A1

公开(公告)日：2016-12-29

申请号：US15188454

申请日：2016-06-21

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Jin Min CHEON ,  Ki Hyeok KWON ,  Min Gyum KIM ,  Joo Young CHUNG ,  Jin Woo CHOI ,  Seung HAN

IPC: H01L23/29 ,  C09D7/12 ,  C09D163/00

CPC classification number: C09D7/63 ,  C08G59/688 ,  C08K3/36 ,  C08K5/053 ,  C08K5/50 ,  C08L63/00 ,  C09D163/00 ,  C09J7/00 ,  H01L23/293 ,  H01L2224/73204 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012

Abstract: An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4: