Invention Application
- Patent Title: MEMORY MODULE
- Patent Title (中): 记忆模块
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Application No.: US15269170Application Date: 2016-09-19
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Publication No.: US20170004871A1Publication Date: 2017-01-05
- Inventor: JONG-HYUN SEOK , DO-HYUNG KIM , WON-HYUNG SONG , YONG-HO LEE
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Priority: KR10-2013-0114689 20130926
- Main IPC: G11C11/4093
- IPC: G11C11/4093
Abstract:
A memory module that includes: a printed circuit board having a connecting terminal; memory chips arranged on the printed circuit board; data buffers disposed on a first surface of the printed circuit board and corresponding to the memory chips; and resistance units disposed on a second surface of the printed circuit board and corresponding to the data buffers.
Public/Granted literature
- US09786354B2 Memory module Public/Granted day:2017-10-10
Information query
IPC分类:
