Invention Application
US20170005056A1 SYSTEMS AND METHODS FOR HIGH-SPEED, LOW-PROFILE MEMORY PACKAGES AND PINOUT DESIGNS
审中-公开
用于高速，低配置的存储器封装和引脚排列设计的系统和方法
- Patent Title: SYSTEMS AND METHODS FOR HIGH-SPEED, LOW-PROFILE MEMORY PACKAGES AND PINOUT DESIGNS
- Patent Title (中): 用于高速，低配置的存储器封装和引脚排列设计的系统和方法
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Application No.: US15266752Application Date: 2016-09-15
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Publication No.: US20170005056A1Publication Date: 2017-01-05
- Inventor: Anthony Fai , Evan R. Boyle , Zhiping Yang , Zhonghua Wu
- Applicant: Apple Inc.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/065
Abstract:
Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.
Public/Granted literature
- US09583452B2 Systems and methods for high-speed, low-profile memory packages and pinout designs Public/Granted day:2017-02-28
Information query
IPC分类:
