A reflow apparatus include a carrier supporting a printed circuit board placed on a side thereof by using a vacuum pressure generated therein, and a processing chamber including a heating chamber and a cooling chamber, wherein the carrier includes at least one adsorption hole, formed in one side of the carrier, a vacuum space connected to the adsorption hole, and a vacuum control unit capable of maintaining or removing a vacuum pressure in the vacuum space by selective opening and closing a path connecting the vacuum space to the outside.